IC Reliability Test Systems Discovery

Can RS Solutions provide a Reliability System Solution for your project(s)?

We define our niche as providing Reliability System Solutions to Reliability labs. If there is an off the shelf system, including those developed by RS Solutions, that meets the Reliability Labs’ needs, that is great – use it. If there is a DUT that requires special consideration – we provide a competitive solution. We’ve found the most effective and efficient way to serve your needs begin with a series of questions. It helps us to zero in on specifications to consider. Please engage the following:

Here are four questions to facilitate our initial discussion:

1. How is the DUT secured in the test system?

Every REL System starts with the Device Under Test (DUT) and some method of holding the DUT – be it a header, load card, coupon, package, socket or other. Number of connections, current and temperature variables, test environment and other factors impact the holding device. Sometimes, this holding device needs to be defined, designed and tested. Other times the holding device is determined and not subject to change.

Please provide a brief description of your DUT (a photo/drawing is always helpful if available), the method of holding the DUT and the test volume you anticipate:

Attach your drawing file here:

2. What are the power supply outputs?

MilliAmps require one set of system requirements. Testing DUT’s at 2, 3, 5…30+ Amps require a broader array of connectors, cooling and heating approaches.

What current/voltage ranges will you be testing the DUTs?

Add any comments, concerns or questions on the power supply:

3. What is the estimated junction temperature of the self-generated heat?

The DUT’s junction temper under power is often difficult to determine. The heat is concentrated in a very small footprint, and heat dissipation is important.
What is the DUT’s junction temperature (an estimate is fine)?

How did you determine the junction temperature?

Add any comments, concerns or questions on the junction temperature:

4. What are the desired test temperatures?

The more narrow the test criteria, the simpler the system. Broader test criteria require more complex system configurations. A system that is only required to cool self-generated heat is simpler than one that requires both cooling and heating. Testing at the extremes, for example cooling below 20˚C and/or heating above 200˚C add complexity to the REL System.

What is the range of your test temperatures?

RS Solutions has 25 years’ experience working with Reliability Labs of major semiconductor companies, and has the knowledge, experience, supply base and passion to provide your REL System Solutions. We understand Reliability Labs’ schedules, budgets, and engineering environment and believe the combination of our experience, 3D CAD modeling capabilities, supply chain, and bench test equipment/capabilities make a strategic complement to your resources.

Now all we need is a little information to follow up.

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High Temperature Systems

Thermal Systems from RS Solutions meet customers’ high end test requirements and exceed the capability of conventional industrial ovens by: (1) developing our custom Thermal Tray System and (2) modifying standard ovens to meet unique test requirements.

IC Reliability Test Tray System

RS Solutions’ Tray System responds to these test parameters. The Tray System utilizes our proven socket technology and places these sockets on a ceramic feed thru that fits over a gold plated heater block. The DUT header sits directly on top of the heater block.

Custom Designed Components

We offer Reliability System Solutions that include heating/cooling, unique holding devices (ie load boards, coupons, ceramic cards, and others), power supplies, software and Operator Interface Terminal. We want to be your first call for new IC test requirements.

Reliability Test Systems

Reliability Test Systems